Wafer-scale p-type 2D semiconductor clears a key hurdle for next-generation chips
A wafer-scale 2D semiconductor combines high hole mobility, strong stability and transistor performance, advancing next-generation CMOS electronics.
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A wafer-scale 2D semiconductor combines high hole mobility, strong stability and transistor performance, advancing next-generation CMOS electronics.
Источник: Компьютерра - Журнал о науке и технологиях Американские инженеры представили полупроводник, который ведет себя не как статичная деталь, а как подвижная система. Его толщ...
The light-controlled electron current could open new paths for sensing, telecommunications, and other advanced technologies. A pair of laser beams can now send electrons through a...
Researchers have developed an ultrathin semiconductor that can be repeatedly programmed, erased and reconfigured with light, pointing towards more adaptable electronic devices in t...
AI is helping create ultra-pure lab-grown diamonds that could cool powerful chips today—but could they one day become semiconductor materials for future electronics? Y Combinator-...
Researchers have built a chip that writes, sorts, and electrically reads information stored in the 'valleys' of an atomically thin material - all at room temperature and without bu...
Single-crystal niobium aluminum nitride films preserve GaN's polar structure, adding a new material option for high-power and high-frequency electronics.
Gaining new insights into the properties and targeted modification of semiconductor surfaces more easily and quickly than before.
The Light That Refuses to Leak — Now Switched On With Electricity Some of the most stubborn light in physics is light that will not leave. Inside specially engineered surfaces, pho...
Can 2D semiconductors replace silicon? A new pilot line targets 5nm-equivalent chips without relying on EUV lithography by 2029. Shanghai-based semiconductor start-up Yuanjiwei has...
One of the largest obstacles limiting the next generation of computer chips may finally have a solution. The shrinking of computer chips has exposed a stubborn problem: even when a...
New manufacturing platforms address high-aspect-ratio etching, advanced memory deposition, metal films, and silicon-carbide epitaxy for next-generation semiconductor production. Se...
Researchers at KAIST have unveiled a groundbreaking solution to one of the most persistent challenges in semiconductor technology: the electrical bottleneck caused by contact resis...
What if materials used in LEDs and implants could be made into nanocrystals? University of Chicago researchers have developed a method to produce them. Researchers at the Universit...
Ultrafast flash heating rearranges atoms in a semiconductor, boosting photocurrent up to 50-fold while preserving glass substrates used in solar cells.
Insider Brief PRESS RELEASE — The next generation of microelectronics relies on radical improvements in transistor switching performance to advance computing power. However, conven...
A chip production method combines molecular materials with semiconductor manufacturing to build molecular memory and computing devices. Researchers at the Massachusetts Institute o...
Researchers have created a device that enables them to control the flow of electrons through a semiconductor using only laser light - no electrical power source required.
A new approach to building faster, more compact optical sensors could help push silicon photonics beyond the limits of conventional semiconductor platforms. In a study published in...
Agnit Semiconductors has emerged from the Indian Institute of Science’s Innovation Centre in Bangalore as the country’s first Gallium Nitride-based semiconductor company.Founded by...
A new bottom gate design takes advantage of the intrinsic properties of SiC. For more than 20 years, silicon carbide – SiC – has been viewed as a promising material for electronics...
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