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Johns Hopkins APL has 3D-printed a phase-change heatsink that cuts size and weight by more than half. Engineers at the Johns Hopkins University Applied Physics Laboratory have deve...
Graphene layers on copper improve lateral heat spreading for processor cooling, while textured surfaces also enhance condensation and wick free vapor chamber performance.
A top-side cooled resistor helps designers manage heat, handle power, and reduce PCB space in automotive circuits. Vishay Intertechnology has introduced the Vishay Sfernice D2TO35S...
Thermal interface materials, cold plate design, coolant flow, and simulations help engineers manage heat and reliability in AI chips. Thermal interface material (TIM) remains a key...
A cooling system uses a liquid that boils to carry heat away from electronic chips and prevent overheating. Researchers at Peking University have developed a chip cooling system th...
Just announced by Exotek is a Clip On Aero Heatsink V3 for short stack motors. The version 3 is more narrow, thus making it easier to use on shorter motors. Here’s the highlights-...
Thermal management components must move heat away from power electronics while maintaining the mechanical relationships required for assembly. Heat sinks, cooling plates, inverter...
Источник: Компьютерра - Журнал о науке и технологиях Тепло, которое выделяют процессоры, обычно считается проблемой — его нужно отводить, чтобы не допустить перегрева. Ученые из Г...
From Exotek Racing: New v3 narrower design for improved fit on new short stack short motors. Extra lightweight (8gr) super cooling alloy finned heatsink for 1/10-1/12 Pan Cars. Upd...
Industrial robots are becoming more compact, more capable, and more dependent on electronics. A modern robotic system may combine servo drives, power converters, motion controllers...
As the semiconductor industry pushes power densities to levels that would have seemed fantastical a decade ago, heat has quietly become the bottleneck that determines how fast, how...
Designing compact AI sensor nodes forces signal integrity and thermal management to compete for limited PCB copper, creating severe PDN and thermal bottlenecks.
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