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Research suggests more than half of electronic product failures stem from thermal failures caused by rising chip junction temperature. As transistor density climbs, power density a...
Artificial intelligence is pushing semiconductor technology toward a physical limit: the more computing power engineers pack into a system, the more difficult it becomes to move da...
Intel and Lens Technology signed a strategic alliance to accelerate glass substrate packaging, as Triassic and Tongge Micro push past the brittleness barrier. TGV yield, multi-laye...
A team of researchers from POSTECH (Pohang University of Science and Technology) in South Korea has unveiled a groundbreaking technique for stacking more than ten ultrathin semicon...
New optical couplers could simplify photonic chip integration while enabling faster, more energy-efficient data transmission. Researchers at the Massachusetts Institute of Technolo...
With EUV lithography tools restricted, Chinese AI chip designers are betting on 3D hybrid bonding and stacking technology to bypass traditional scaling limits and compete on perfor...
A new light-based device redirects beams in 74 femtoseconds, using ultrathin engineered surfaces to enable faster photonic communications and computing.
Can AI chip development become faster and less complex? A modular chiplet approach aims to simplify custom silicon design. TYLsemi has introduced a production-ready chiplet portfo...
Henkel Adhesive Technologies announced the launch of Loctite ABLESTIK CDF900, its next-generation conductive die attach film (cDAF) series, at SEMICON Taiwan 2026. Delivering therm...
Don Clark / New York Times: A look at advanced chip packaging, now more reliant on TSMC and its partners in Taiwan than ever, and the efforts to address this bottleneck in the US ...
Chinese semiconductor design firm Biren Technology has unveiled its next-generation “supernode” solutions – systems designed to link thousands of AI chips across a single cluster –...
Researchers develop prototype thin-film electronics that can dock and undock themselves.
Samsung Electronics showcased its next-generation 3D memory architectures at the Future of Memory and Storage 2026 in California on Tuesday (local time), unveiling mockups of zHBM...
Insider Brief Press release – Silicon photonics has emerged as a promising technology for addressing bandwidth and latency bottlenecks of conventional electrical interconnects and...
A chip production method combines molecular materials with semiconductor manufacturing to build molecular memory and computing devices. Researchers at the Massachusetts Institute o...
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