Latest updates for Chip Manufacturing
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Recent items include:
- Chip tech to deliver major performance leap: IBM
- India’s CG Semi starts commercial chip production at $870M Gujarat plant
- Dutch chip startup claims all-European fab flow – with help from a very American friend
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India’s CG Semi starts commercial chip production at $870M Gujarat plant
Prime Minister Narendra Modi has inaugurated commercial production at CG Semi’s chip assembly and testing plant in Sanand, Gujarat. The facility will initially turn out 200 million...
Dutch chip startup claims all-European fab flow – with help from a very American friend
Satnav parts designed and manufactured in the EU, but using GlobalFoundries to produce them
TSMC’s latest chip packaging breakthrough promises lower costs and better performance
TSMC's upcoming CoPoS packaging technology could reduce chip costs while improving AI performance, with mass production reportedly targeted for 2028.
2D Chip Opens New Path for Computing
A computer built with a 2D semiconductor integrates more than 1,400 transistors on one chip, demonstrating a path toward AI and edge computing. Researchers from Nanjing University,...
Chipmaking Technologies Target 2nm Designs
What happens when transistor dimensions approach atomic limits? New chipmaking technologies are helping improve AI chip performance and efficiency. Applied Materials has introduced...
Pilot Line Advances 2D Chipmaking
Can 2D semiconductors replace silicon? A new pilot line targets 5nm-equivalent chips without relying on EUV lithography by 2029. Shanghai-based semiconductor start-up Yuanjiwei has...
IBM Launches Super-Powerful Chip
The semiconductor manufacturer says the technology demonstrates how continued gains in performance and efficiency remain possible even as chip features approach atomic dimensions
Semiconductor Chip Writes DNA Sequences in Parallel
What if a computer chip could manufacture DNA? Researchers have now used semiconductor technology to write dozens of genetic sequences simultaneously. Researchers at Harvard Univer...
Orbis' Alec Cutler: Chip manufacturing to become a 'quasi-commodity'
Ever-rising demand for compute due to AI, coupled with supply issues, is turning chipsets into a “quasi-commodity”, according to Orbis Investment Management portfolio manager Alec...
IBM's New Chip Fits Nearly 100 Billion Transistors in the Size of a Fingernail
IBM's newest chip has transistors smaller than one nanometer. But it could pack a powerful punch in future data centers.
IBM stacks up a sub-nanometer chip future
Big Blue shows off process node it claims can scale down to 1 Angstrom
IBM Unveils ‘Smallest, Most Powerful Chip in the World’
IBM leveraged its nanostack architecture, a technique that "builds a chip like a city," to pack nearly 100 billion transistors on a fingernail-sized chip.
We Thought Computer Chips Were Running Out of Room. IBM Found a New Way Forward.
The new chip technology packs nearly 100 billion transistors into a fingernail-sized chip.
Record-breaking IBM chip uses trick to cram in 100 billion transistors
IBM's latest chip packs in twice as many transistors as the current state-of-the-art chip by adding a second layer of silicon circuitry
Revolutionizing Chip Design: Sequential Silicon Stacking to Push Moore’s Law Further
For over fifty years, the relentless pursuit to enhance computing power has centered on shrinking transistors and densely packing them onto silicon chips. This well-established tra...
Стартап Джима Келлера собрался поставить производство фабрик по выпуску чипов на конвейер
Atomic Semi, основанная известным разработчиком процессорных архитектур Джимом Келлером (Jim Keller) и инженером Сэмом Зелуфом (Sam Zeloof), который стал известен созданием микросх...
Students Build Semiconductor Fabrication Lab
An undergraduate team is building semiconductor fabrication tools from scratch, showing a practical path to train India’s future chip manufacturing workforce. Students at IIT Bomba...
A look at advanced chip packaging, now more reliant on TSMC and its partners in Taiwan than ever, and the efforts to add...
Don Clark / New York Times: A look at advanced chip packaging, now more reliant on TSMC and its partners in Taiwan than ever, and the efforts to address this bottleneck in the US ...
TSMC's new packaging technology will bring down chip cost and improve performance
According to sources familiar with the matter, TSMC is working on a cutting-edge technology for chip packaging called CoPoS. CoPoS means Chip-on-Panel-on-Structure, and it uses a g...
China's Chip Manufacturers Increasingly Venture into Semiconductor Equipment Production
SAI Microelectronics, Jiaxin Semiconductor founded by SMIC's Richard Chang, and Biwin Storage are among a growing wave of Chinese chip makers expanding into upstream semiconductor...
IBM Unveils Sub-1 Nanometer Chip With 100 Billion Transistors, Extending Moore’s Law
IBM on Thursday unveiled the world’s first sub-1 nanometer chip technology, a research prototype at the 0.7 nanometer node that packs nearly 100 billion transistors onto a chip the...
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