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A new in-package cooling innovation tackles rising heat challenges in 3D-stacked memory chips, improving thermal efficiency and stability for AI workloads while enabling higher ban...
A new generation of silicon carbide power devices introduces top-side cooling in a surface-mount package, enabling higher output power, improved thermal performance, and greater de...
Expert interview with Martin Bentz, CEO of Outlast Technologies Modern soldier systems are becoming more advanced, more protective and more complex. But with every additional layer...
A reconfigurable device breaks the usual link between heat absorption and emission, enabling direction-controlled thermal radiation for future sensors and cooling.
A South Korean startup, KoolMicro, is betting that liquid cooling built into the chip package itself is the only way to handle the next generation of GPU heat loads.
Can microscopic water channels inside chips dramatically cut cooling energy while helping AI processors handle rising computational demands? Researchers at the Korea Advanced Inst...
ROHM Semiconductor has launched the TSC3PAK, a new package for SiC MOSFETs that delivers heat dissipation performance comparable to conventional TO-247-4L through-hole packages whi...
A power device package combines isolation, cooling, and reduced EMI in a design that helps engineers build high-voltage systems with fewer components. Navitas Semiconductor has lau...
USA: A recent study by University of Notre Dame researchers claims to have developed an ink-based printing technology to create low-cost and high-performance thermoelectric materia...
Tilta has introduced a new Universal Cooling System that was designed for use with cameras that are susceptible to overheating when used for extended periods of time in hot conditi...
Tilta has introduced the Universal Cooling System, a thermoelectric camera cooler that clamps to the back of a wide range of mirrorless bodies to fight overheating and extend recor...
Released on Friday was the newest version of Intel Thermald, the thermal daemon developed by Intel for their processors on Linux for monitoring and helping control temperatures acr...
Electronic devices produce more heat as they become more powerful. A new bacteria-based material could offer a better way to keep them cool. Researchers at the University of Tennes...
LG’s thermal and power solutions support AI data centers with advanced air cooling, liquid cooling, immersion cooling, intelligent energy management and high-efficiency power infra...
Компания Intel применила в эталонном ноутбуке на процессоре Wildcat Lake систему охлаждения на основе испарительной камеры и твердотельного кулеру AirJet Mini от компании Frore Sys...
Sponsored by Heraeus Electronics. The electric vehicle market is emerging as a leading field for advanced heating technologies. In EVs, heating systems are essential not only for p...
Could nature inspired microscopic structures unlock cooler AI chips while reducing the growing energy and water demands of future data centers? Researchers at the University of Hou...
Apacer has announced GraTherX, a new memory module cooling technology developed to improve thermal performance and reliability in systems operating with limited or no airflow. The...
Parker Hannifin has launched a new liquid-dispensed thermal barrier designed to enhance battery pack safety in cylindrical cell applications. The new CoolTherm SF-1000 Silicone Foa...
JAPAN: Daikin is to begin joint verification of a cooling optimisation solution to predict the thermal state inside data centre servers with leading IT company NTT Data. ... Read M...
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