Social Media Ideas for Thermal Management

WayKen Manufactures Thermal Management Components for Power Electronics

Thermal management components must move heat away from power electronics while maintaining the mechanical relationships required for assembly. Heat sinks, cooling plates, inverter...

Thermal Interface Material Bottlenecks in AI Chip Cooling

Thermal interface materials, cold plate design, coolant flow, and simulations help engineers manage heat and reliability in AI chips. Thermal interface material (TIM) remains a key...

A comprehensive PSA-tape-based strategy for thermal runaway prevention and mitigation in battery packs

By Max VanRaaphorst, Avery Dennison. The transition toward electrification has boosted the demand for high-performance batteries, which in turn has accelerated the need for scalabl...

Power Resistor Supports Top-Side Cooling

A top-side cooled resistor helps designers manage heat, handle power, and reduce PCB space in automotive circuits. Vishay Intertechnology has introduced the Vishay Sfernice D2TO35S...

Overcoming Signal Integrity and Thermal Bottlenecks in AI-enabled Sensors

Designing compact AI sensor nodes forces signal integrity and thermal management to compete for limited PCB copper, creating severe PDN and thermal bottlenecks.

How Thermal Management Keeps Your Car Cool in Extreme Heat

Extreme heat can be tough on your car. High temperatures do more than make the cabin uncomfortable. They can also put extra stress on the engine, cooling system, air conditioning, ...

TDK’s new DC-link film capacitors are rated for up to 135° C

TDK has announced the B3272*A/G/T series of DC-link film capacitors, qualified for continuous operation at case temperatures up to 135° C. The parts require no derating up to 105°...

Nanotechnology moves closer to the AI chip cooling problem

How nanotechnology could improve AI chip cooling, from thermal interface materials and high-bandwidth memory packaging to nanostructured surfaces and microfluidics.

Cooling Chips With Insulating Liquid

A cooling system uses a liquid that boils to carry heat away from electronic chips and prevent overheating. Researchers at Peking University have developed a chip cooling system th...

Summit 2026 - Advanced Packaging Materials as Enablers for High-Density Power Electronics in AI Data Centers

The rapid deployment of AI workloads in data centers is driving new requirements for power electronics, including very high power density, fast load transients, and strict efficien...

Phase-Change Heatsink Cuts Size and Weight by Half

Johns Hopkins APL has 3D-printed a phase-change heatsink that cuts size and weight by more than half. Engineers at the Johns Hopkins University Applied Physics Laboratory have deve...

Parker expands CoolTherm line with three new thermal adhesives

The Performance Materials Division of Parker Hannifin has launched three new thermal adhesives, expanding its CoolTherm portfolio for EV and industrial electrification applications...

Tin-modified nanotube gel reduces solar cell temperature by 9.5 C

Researchers in India have developed a reusable tin-modified carbon nanotube gel that reduces solar cell operating temperatures by 9.5 C and improves power conversion efficiency. Th...

AAEON Breaks Down Thermal Barriers with the New UP Xtreme PTL Edge Air

With AirJet solid-state active cooling technology, the UP Xtreme PTL Edge Air is 35% thinner and 43% lighter while delivering Intel® Core™ Ultra Series 3 performance.

Toray tests a prototype film capacitor in an inverter at 150° C

Materials company Toray has tested an inverter at 150° C using a prototype film capacitor made with a proprietary heat-resistant dielectric film. The film is designed to enable air...

Cooling film can reduce vehicle cabin temperatures

USA:  American multinational conglomerate 3M is launching a cooling film designed to help keep vehicle cabins cooler.... Read More... The post Cooling film can reduce vehicle cabin...

Ministry recognizes heat management as priority

Immersion-Cooled Battery Targets Electric Vessels

Can marine batteries deliver high power without adding thermal risks or taking up more space? An immersion-cooled system targets all three challenges. XING Mobility has launched th...

xMEMS Introduces Solid-State Micro-Cooling to Edge AI and Data Centers

Announced today, the company's new PiezoMEMS air movers reach subsystems that conventional fans and cold plates can’t.

Module cooling: too hot to handle

Even after the record-breaking heat waves of this summer and associated performance losses at PV plants across the northern hemisphere, active cooling for solar arrays remains a di...

Intel Thermald 2.5.13 Restores Accidentally Deleted Wildcat Lake Support

Intel's Thermald released on Thursday as the newest update to this daemon for thermal monitoring on Intel hardware that was also recently extended for beginning to support Qualcomm...

Qualcomm Patching Linux For Hardware Thermal Binning To Benefit Snapdragon X Laptops

A new patch series sent out from Qualcomm that aims to help at least the Snapdragon X series laptops is hardware-binned trip point support. Some Qualcomm SoCs are available in diff...

Pack-Agnostic Thermal Runaway Early Warning: A Self-Contained Multi-Sensor Module for Battery Energy Storage

Battery energy storage systems (BESS) at solar farms and C&I sites can fail through thermal runaway: one overheating cell vents gas and triggers a chain reaction across the pac...

Battery Thermal Management by Design: How Advanced Materials Are Enabling the Next Generation of EV Batteries

Sponsored by H.B. Fuller As electric vehicles evolve, battery design is undergoing a fundamental transformation. Automakers are under pressure to deliver greater driving range, fas...