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MediaTek unveils Dimensity 8550 with LLM Booster and support for Gemini Nano V3

Earlier this year, MediaTek unveiled the Dimensity 8500, a 4nm (TSMC N4P) chipset with all-big CPU cores (eight Cortex-A725) and a Mali-G720 MC8 GPU. Now the company is refreshing...

MediaTek Dimensity 9600 Specs Surface Online Ahead of Expected Launch

MediaTek’s upcoming flagship smartphone chipset, the Dimensity 9600, has reportedly surfaced online ahead of its expected launch later this year. ... Read More

MediaTek Launches Dimensity 8550: A 4nm All-Big-Core Mobile SoC with On-Device AI Focus

MediaTek has released the Dimensity 8550, a 4nm N4P mobile platform featuring an all-big-core Cortex-A725 CPU architecture, an 880 NPU unit with native Google Gemini Nano V3 suppor...

MediaTek представила чип Dimensity 8550 для мощных смартфонов среднего уровня — он поддерживает Gemini Nano v3

Недавно Google анонсировала Gemini Intelligence с интерактивным интерфейсом на Android-смартфонах. Однако системные требования могут «оставить за бортом» даже некоторые флагманские...

MediaTek unveils Dimensity 7500 with Arm C1 CPU, faster NPU

MediaTek just unveiled the Dimensity 7500 with an upgraded CPU, GPU, and NPU. The SoC will compete head-on with Qualcomm's Snapdragon 7 series and will power upper-midrangers in th...

Huion Note E – A 8.4-inch Android 15 electronic notebook with battery-free, pressure sensitive stylus

Huion Note E is an Android 15 note-taking device/electronic notebook powered by a MediaTek Helio G99 SoC and equipped with an 8.4-inch color LCD designed to work with a battery-fre...

MediaTek представила чип Dimensity 7500, который ускорит игры и ИИ в массовых смартфонах

Компания MediaTek представила мобильный процессор Dimensity 7500, ориентированный на массовые смартфоны и предлагающий улучшения в области искусственного интеллекта, игр, производи...

Taiwan's MediaTek partners with Intel and TSMC for advanced chip packaging

Honor 600 Pro стал первым в мире смартфоном на чипе MediaTek Dimensity 8550

Компания MediaTek официально представила однокристальную систему Dimensity 8550. Первым коммерческим устройством на базе нового чипа стал смартфон Honor 600 Pro. Об этом сообщает и...

Bigme Hibreak Dual 2 – An Android 16 smartphone with 6.13-inch 80fps E-Ink and 5-inch LCD display (Crowdfunding)

Bigme has launched the Hibreak Dual 2, an Android 16 smartphone with a 6.13-inch 80fps E-Ink display on the front and a 5-inch LCD on the rear. Built around the MediaTek Dimensity...

MediaTekがCOMPUTEXで6G無線プロトタイプとAIネットワーク最適化技術を初披露、最新トレンドをチェック

MediaTekが、COMPUTEX TAIPEI 2026において次世代通信規格「6G」のプロトタイプや、人工知能（AI）を活用したネットワーク最適化技術、車載向けのSoCなどを公開した。

Redmi 17C Launched with MediaTek Helio G81 Ultra Chipset

Redmi, the sub-brand of Xiaomi, has launched the new Redmi 17C. It is an affordable phone, powered by a MediaTek ... Read More

MediaTek and NVIDIA Introduce RTX Spark SoC for Next-Gen Windows 11 AI PCs

MediaTek and NVIDIA have announced RTX Spark, a new SoC platform aimed at Windows 11 PCs designed for local AI processing, gaming performance, and content creation in thin and powe...

Now even MediaTek’s cheap chips are embarrassing the Tensor G5 in one major area

This MediaTek chip is expected to appear in cheap phones, but it shows up the Tensor G5 in a key area.

$54 ThinkNode G4 Wi-Fi HaLow gateway extends the range of Ethernet or 2.4 GHz WiFi 4 devices

Elecrow’s ThinkNode G4 is a Wi-Fi HaLow gateway with Ethernet and 2.4 GHz WiFi that allows you to connect compatible devices or extend the range of existing devices when used with...

Redmi 17C debuts with Helio G81 Ultra chipset, very low price

The Redmi 17C is now official. It comes with a 6.88-inch 720x1640 IPS LCD screen with 600-nit peak brightness and a 120Hz refresh rate, a 13MP rear camera, a 5MP front camera, and...

Qualcomm Dragonwing Mobile Broadband Multimedia (MBM) MBM715 and MBM 415 SoCs combine 5G, Wi-Fi, multimedia, and Edge AI

Qualcomm has introduced the Dragonwing Mobile Broadband Multimedia (MBM) family, a new lineup of 4-nm SoCs that integrate 5G connectivity, Wi-Fi, multimedia processing, and on-devi...

Redmi Turbo 6 Max screen and chipset details emerge

The Redmi Turbo 5 Max launched in January and now the brand is apparently already working on its successor, the Turbo 6 Max. This isn't coming anytime soon, though, as rumor has it...

This new chip could bring Gemini Intelligence to non-flagship Android phones

Don't expect big upgrades elsewhere, though.

TECNO представила Spark 50 Pro с камерой Sony на 50 Мп

Источник: Компьютерра - Журнал о науке и технологиях Компания TECNO официально анонсировала новый смартфон Spark 50 Pro, который получил сразу несколько особенностей, редко встреч...

Geniatech APC888 NXP i.MX 95-powered Edge AI Box PC takes M.2 AI accelerator from Hailo, MemryX, NXP, or DeepX

Geniatech APC888 Edge AI Box PC is powered by an NXP i.MX 95 Cortex-A55/M7/M33 applications processor, and features an M.2 socket for AI accelerator from Hailo, MemryX, DeepX, or K...

Amlogic A311Y3 octa-core Edge AI SoC features Cortex-A78/A55 cores, 8 TOPS NPU, LPDDR5 support

Amlogic has introduced the A311Y3 Edge AI SoC, which seems to be an upgrade over earlier designs such as the A311D and A311D2 used in boards like the Khadas VIM3 and Khadas VIM4. A...

Oppo Find X10 Pro's main specs leak

The Oppo Find X10 family is expected to be launching in September, and one of the members arriving at that point will be the Find X10 Pro. According to a new rumor, this device wil...

Thundercomm TurboX C7790 Android and Linux development kit features Qualcomm Dragonwing Q-7790 Edge AI SoC

Thundercomm has launched the TurboX C7790 development kit, a compact edge AI platform built around the Qualcomm Dragonwing Q-7790 (CQ7790S) processor. The kit offers up to 24 TOPS...