Search results for Finfet

Эволюция транзисторных архитектур чипов и переход к обратной подаче питания

На протяжении более чем десятилетия архитектура транзисторов с вертикальным затвором (Fin Field-Effect Transistor, FinFET) служила главным технологическим фундаментом микроэлектрон...

Paragraf Unwraps Graphene-Based FET Made at New Graphene Foundry

Paragraf recently introduced a new GFET, a next-generation graphene transistor platform designed for scalable molecular sensing and research applications.

Paragraf launches PMF2000 GFET

Paragraf has announced the launch of its latest Graphene Field Effect Transistor (GFET), the PMF2000, marking a step forward in scalable graphene device manufacturing.The PMF2000 b...

​Paragraf launches PMF2000 GFET 

Paragraf has announced the launch of its latest Graphene Field Effect Transistor (GFET), the PMF2000, marking a step forward in scalable graphene device manufacturing. The PMF2000...

Jusung Engineering commercializes ALG transistor integration technology

Jusung Engineering announced Monday that it has shipped what it described as the world’s first atomic layer growth (ALG) transistor full-integration semiconductor manufacturing equ...

Advancing Backside Power Delivery with Ruthenium Nano-TSV and All-Dry SOI Thinning

In a groundbreaking advancement for three-dimensional (3D) integrated circuit technology, a research team has unveiled an innovative fabrication process that seamlessly integrates...

Tools to build high-density chip systems

The process design kits open early access to high-density chip connections, giving you a way to test, build, and push multi-chip systems toward real use cases. The NanoIC pilot lin...

Revolutionizing Chip Design: Sequential Silicon Stacking to Push Moore’s Law Further

For over fifty years, the relentless pursuit to enhance computing power has centered on shrinking transistors and densely packing them onto silicon chips. This well-established tra...

Japan's Fujitsu to develop cutting-edge 1.4-nm chips for AI processing

India Moves Up the Chip Stack With 3D Packaging Push 

Moving past fabrication focus, India explores advanced packaging where stacking, integration, and materials innovation begin to shape next generation electronic systems  India’s se...

Radio-frequency transistors break 100 GHz barrier

Carbon nanotube transistors operate above 100 GHz with low power use, supporting 6G networks, wearable devices, and electronics. Researchers at Peking University and Stanford Unive...

Tesla, SpaceX to use Intel 14A process to make AI chips at Musk's Terafab

Nexperia to manufacture next-gen power MOSFETs at Polar Semiconductor’s Minnesota foundry

Nexperia and Polar Semiconductor have announced a manufacturing collaboration under which Nexperia’s next-generation power MOSFETs will be produced at Polar’s wafer foundry in Bloo...

【速報】IntelがTerafabプロジェクトに正式参加〜チップ設計・製造・パッケージングで協力

Intelが本日、「Terafab (テラファブ)」プロジェクトへの正式参加を発表しました。 「Terafab」は、SpaceX・Tesla・xAIが共同で進める超大規模チップ製造計画で、これに米半導体大手が加わる形...

TSMC запланировала начать опытный выпуск чипов по субнанометровому техпроцессу A10 к 2029 году

На техпроцесс 3 нм за I квартал пришлись 25 % выручки, рассказал в ходе брифинга, посвящённого финансовым показателям TSMC по итогам финансового года, глава компании Си Си Вэй (C.C...

Report: Samsung Foundry surpasses 80% yield on 4nm chips

A new report coming from South Korea suggests Samsung Foundry has reached an important milestone in its 4nm FinFET process production. According to SEDaily, Samsung Foundry has sur...

Tiny Memory Device Challenges Limits of Chip Scaling

A memory device does the unexpected as it gets smaller and performs better, pointing to longer battery life and lower energy use. Researchers at Institute of Science Tokyo have dev...

Printed Oxygen “Highways” Break Through 2D Transistor Speed Barrier

In a groundbreaking advancement poised to redefine the future of electronics manufacturing, researchers have unveiled a revolutionary method to overcome one of the long-standing ba...

RISC-V chip designer SiFive raised a $400M Series G led by Atreides at a $3.65B valuation; CEO Patrick Little says it is...

Stephen Nellis / Reuters: RISC-V chip designer SiFive raised a $400M Series G led by Atreides at a $3.65B valuation; CEO Patrick Little says it is the final funding round before an...

SiFive raises $400 million from Atreides, Nvidia for data-center chip technology

FusionAP’s US$2M raise signals Malaysia’s push up the semiconductor value chain

FusionAP, a Malaysia-based advanced semiconductor packaging startup founded by former Intel and TSMC veterans, has closed a US$2 million pre‑seed round co‑led by Vertex Ventures So...

Niuxin Semiconductor Expands PCIe IP Portfolio Across Multiple Generations

Niuxin Semiconductor has built a full PCIe IP portfolio from 3.0 to 5.0, supporting applications in AI computing and data centers, with PCIe 6.0 already developed and moving toward...

The hidden gap that could derail the future of 2D semiconductor chips

Researchers discover an atomic-scale gap between 2D materials and insulators that limits chip miniaturization and identify 'zipper materials' as the fix.

India’s Semiconductor Leap: TATA’s ₹91,000-Crore Dholera Fab Anchors Nation’s Chip Future At 28nm

The announcement of TATA Electronics’ ₹91,000-crore semiconductor fabrication facility at Dholera, Gujarat, marks a decisive moment in India’s industrial and technological trajecto...