Cooling Chips With Insulating Liquid
A cooling system uses a liquid that boils to carry heat away from electronic chips and prevent overheating. Researchers at Peking University have developed a chip cooling system th...
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A cooling system uses a liquid that boils to carry heat away from electronic chips and prevent overheating. Researchers at Peking University have developed a chip cooling system th...
Johns Hopkins APL has 3D-printed a phase-change heatsink that cuts size and weight by more than half. Engineers at the Johns Hopkins University Applied Physics Laboratory have deve...
Thermal interface materials, cold plate design, coolant flow, and simulations help engineers manage heat and reliability in AI chips. Thermal interface material (TIM) remains a key...
A top-side cooled resistor helps designers manage heat, handle power, and reduce PCB space in automotive circuits. Vishay Intertechnology has introduced the Vishay Sfernice D2TO35S...
Thermal management components must move heat away from power electronics while maintaining the mechanical relationships required for assembly. Heat sinks, cooling plates, inverter...
Компания xMEMS объявила о начале серийного производства твердотельных систем охлаждения XMC-2400 и XMC-4800. В их основе лежит технология piezoMEMS, использующая пьезоэлектрический...
A GaN device uses cooling from both sides to manage heat and save space in AI data centre power systems. Renesas Electronics Corporation has launched a 650V gallium nitride (GaN) d...
A flexible nanocellulose film absorbs moisture from the air and releases it through evaporation, cooling electronic devices for over 12 hours without external power or water.
Announced today, the company's new PiezoMEMS air movers reach subsystems that conventional fans and cold plates can’t.
Industrial robots are becoming more compact, more capable, and more dependent on electronics. A modern robotic system may combine servo drives, power converters, motion controllers...
Источник: Компьютерра - Журнал о науке и технологиях Тепло, которое выделяют процессоры, обычно считается проблемой — его нужно отводить, чтобы не допустить перегрева. Ученые из Г...
The rapid deployment of AI workloads in data centers is driving new requirements for power electronics, including very high power density, fast load transients, and strict efficien...
Источник: Компьютерра - Журнал о науке и технологиях Экстремальная жара — враг номер один для любой техники. Она размягчает металлы, разрушает электронные схемы, превращает смазку...
Two-component materials are designed to protect automotive sensors, industrial electronics, and equipment used in hazardous areas. Amatech Innovation has launched the Linkobond 270...
How nanotechnology could improve AI chip cooling, from thermal interface materials and high-bandwidth memory packaging to nanostructured surfaces and microfluidics.
Graphene layers on copper improve lateral heat spreading for processor cooling, while textured surfaces also enhance condensation and wick free vapor chamber performance.
Can marine batteries deliver high power without adding thermal risks or taking up more space? An immersion-cooled system targets all three challenges. XING Mobility has launched th...
GERMANY/JAPAN: Researchers in Germany and Japan have developed a new approach to solid-state cooling that uses heat instead of electricity.... Read More... The post Solid-state coo...
Compute can be bought, but heat rejection must be engineered. Nvidia’s Ajay Sekar reveals how warm-water liquid cooling is redefining the economics and geography of AI factories
A steerable radiative-cooling emitter delivers 135 per cent more cooling power than the same emitter in a fixed configuration, while dynamically adjusting its exposure to the sky a...
Lenovo’s Project AeroBlade is one of the more technically interesting laptop concepts the company is showing this year. The 14-inch notebook measures less than 10mm thick and weigh...
USA: American multinational conglomerate 3M is launching a cooling film designed to help keep vehicle cabins cooler.... Read More... The post Cooling film can reduce vehicle cabin...
As the semiconductor industry pushes power densities to levels that would have seemed fantastical a decade ago, heat has quietly become the bottleneck that determines how fast, how...
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