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thequantuminsider.com /3 weeks ago

QTREX Develops Cryogenic Chip Carrier for Quantum Computing Applications

Insider Brief PRESS RELEASE — QTREX Quantum Ltd. (Nasdaq: QTEX) (“QTREX” or the “Company”) a company focused on advancing Additively Manufactured Electronics (“AME”) for quantum co...

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quantumcomputingreport.com /3 weeks ago

QTREX Quantum Fabricates Cryogenic Chip Carrier via Single-Build Additive Process

QTREX Quantum Ltd. (Nasdaq: QTEX) has fabricated a cryogenic chip carrier utilizing its proprietary single-build Additively Manufactured Electronics (AME) process. Built using a de...

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nanowerk.com /1 month ago

Cryogenic silicon carbide transistor mimics neuron-like switching

A silicon carbide transistor uses negative differential resistance at millikelvin temperatures to enable low-power local control near quantum processors.

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electronicsforu.com /1 month ago

Chip Cooling Technique for AI

A new in-package cooling innovation tackles rising heat challenges in 3D-stacked memory chips, improving thermal efficiency and stability for AI workloads while enabling higher ban...

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allaboutcircuits.com /1 month ago

Microchip Ruggedizes Evacuated Miniature Crystal Oscillators

The EX-423 adds four-point crystal mounting, ultra-high vacuum housing, and MIL-STD-202 to Microchip's EX-421 EMXO lineup.

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chargedevs.com /3 weeks ago

ROHM brings TO-247-class cooling to surface-mount SiC MOSFET package

ROHM Semiconductor has launched the TSC3PAK, a new package for SiC MOSFETs that delivers heat dissipation performance comparable to conventional TO-247-4L through-hole packages whi...

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quantumcomputingreport.com /5 days ago

EeroQ Validates CMOS-Controlled Electron Shuttling on Superfluid Helium for All-to-All Qubit Routing

Schematic rendering of EeroQ’s Wonder Lake chip stack. Quantum hardware developer EeroQ has published peer-reviewed experimental results demonstrating the selective, two-dimensiona...

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allaboutcircuits.com /1 month ago

The Cooling Problem That Could Bottleneck AI

A South Korean startup, KoolMicro, is betting that liquid cooling built into the chip package itself is the only way to handle the next generation of GPU heat loads.

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3dnews.ru /1 month ago

Российский чипмейкер «Микрон» запустил продажу сувениров — 200-мм пластин с чипами и пробирок с воздухом из «чистой комн...

Российский производитель полупроводниковой продукции АО «Микрон» расширил ассортимент доступных для покупки сувениров. Речь о 200-мм пластинах, на которых размещено от 30 до 120 ты...

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chargedevs.com /1 month ago

Hoenle’s Structalit 8205 underfill for automotive power electronics survives 1,000 thermal cycles

Hoenle Adhesives (formerly Panacol) has launched Structalit 8205, a board-level underfill designed for flip chips, BGAs and CSP packages in automotive electronics, power electronic...

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electronicsforu.com /2 weeks ago

Radiation-Hardened 45nm Space Chip Passes Strategic Mission Tests

Built to survive extreme radiation where conventional processors fail, this 45nm space chip delivers resilient computing for satellites and deep-space missions. BAE Systems has ann...

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news.mit.edu /4 weeks ago

Flexible cryogenic cables solve a challenge in quantum system development

A prototype wiring system for dilution refrigerators could advance the realization of practical quantum computers.

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electronicsforu.com /1 month ago

Power Package Combines Cooling and Isolation

A power device package combines isolation, cooling, and reduced EMI in a design that helps engineers build high-voltage systems with fewer components. Navitas Semiconductor has lau...

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fiercesensors.com /4 weeks ago

The quest for better chip design accelerates

Synopsys announces Multiphysics Fusion products and early customers to lower prevent respins and lower costs

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runet.news /1 month ago

Ученые в Гонконге создали нейроморфные чипы для работы при абсолютном нуле

Специалисты Гонконгского университета и Центра передовых полупроводников и интегральных схем разработали аппаратную платформу на основе карбида кремния, способную работать при темп...

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qchron.com /1 month ago

Carbice and Noctua Partner to Bring Advanced Thermal Pad Technology to DIY PC Builders

Noctua is the exclusive retail distributor of CarbiceÂ® IP90 thermal pads for the DIY PC market, beginning with the NT-CP1 AM5/4 for AMD Ryzenâ„¢ processors

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thequantuminsider.com /1 month ago

C12 Introduces Nanoassembly Process for Carbon Nanotube Quantum Chips

Insider Brief PRESS RELEASE — C12, a Paris-based quantum computing company developing carbon nanotube spin qubit processors, today announced its proprietary Pick & Place nanoa...

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allaboutcircuits.com /1 month ago

Microchip Releases Data Center Retimers for High‑Bandwidth Architectures

The new XpressConnect PCIe 6.0 and CXL 3.1 Retimers reign in signal integrity challenges in AI data centers and other high-bandwidth installations.

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thequantuminsider.com /1 month ago

Qubic Announces Sale of Cryogenic Amplifiers to Quantum Machines

Insider Brief PRESS RELEASE — – Qubic, a developer of enabling hardware for quantum computing, sensing and defence, today announces it has secured a contract with its first custome...

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habr.com /2 weeks ago

Захватить клетку и не повредить: как устроен CMOS-чип с микрозахватами

Несмотря на развитие Lab-on-a-Chip, механически взять живую клетку, удержать и переместить, не повредив мембрану, практически невозможно. Отсутствие такого инструмента серьезно огр...

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thequantuminsider.com /1 month ago

HKU Engineering Develops ‘Brain-Like’ Chip to Advance Quantum Computing And Deep-Space Exploration

Insider Brief PRESS RELEASE — Researchers from Department of Electrical and Computer Engineering under the Faculty of Engineering at the University of Hong Kong (HKU) and the Centr...

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electronicsforu.com /1 week ago

3D Printed Cooling Plates Slash Power Use

Could a redesigned copper cooling plate dramatically lower data center energy use while handling rising chip heat more efficiently than existing methods? Researchers at the Univers...

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electronicsforu.com /1 month ago

SiC Power Devices Gain Cooling

A new generation of silicon carbide power devices introduces top-side cooling in a surface-mount package, enabling higher output power, improved thermal performance, and greater de...

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electronicsforu.com /1 month ago

New Film Material Targets Advanced Chip Packaging

Aims to simplify large-panel semiconductor packaging, improve manufacturing efficiency, and support finer circuitry and multi-layer structures required for AI-driven chip designs....

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