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New manufacturing platforms address high-aspect-ratio etching, advanced memory deposition, metal films, and silicon-carbide epitaxy for next-generation semiconductor production. Se...
ISM CEO Amitesh Kumar Sinha explains how a semiconductor chip is made, from sand and design to test and packaging, and why fabs cost billions.
India’s semiconductor manufacturing drive has reached a new milestone with two additional plants commencing commercial production — the CDIL Semiconductor ATMP Facility and the Suc...
Chinese chipmakers are setting increasingly aggressive targets to source production equipment locally, adding pressure on domestic toolmakers to come up with machines that are reli...
Building a chip should not require assembling an entire design ecosystem. A Noida-based startup is developing a browser-based EDA platform that aims to reduce dependence on expensi...
As chipmakers stack dies vertically to meet surging AI demand, 2D imaging is losing its edge. Automated 3D reconstruction is becoming essential to keeping fabs on pace.
Silicon DreamsSEMICON India 2026 and the Making of a Chip PowerhousePosted On: 15 SEP 2026 10:52AM by PIB DelhiOn September 17, Prime Minister Narendra Modi will walk into Yashobh...
TATA Electronics has entered a crucial new phase at its semiconductor packaging facility in Jagiroad, Assam, with pilot chip production now under way as the company prepares for fu...
Chipmaking changes could boost productivity of new ASML machines by 40 percent.
The multiyear agreement aims to expand capacity for TSMC's advanced packaging and support growing demand for artificial intelligence and high-performance computing technologies.
Companies across industries are leveraging tech from NXP, MaxLinear and Nordic Semiconductor on automotive UWB, accelerated OpenZFS storage, and low-power Bluetooth Mesh sensing.
Can stacked chips hide defects that conventional inspection misses? Inspection and wafer correction systems target two manufacturing challenges affecting advanced semiconductor pac...
Tata Electronics signs Nexperia chip deal plus four partnerships spanning materials, packaging, indigenization and talent in India.
In a milestone shift for semiconductor engineering, Cognichip, the frontier lab building Artificial Chip Intelligence ACIâ„¢, today announced the availability of ACI Enterprise, t...
This semiconductor design firm is expanding front-end chip design and verification as it moves towards developing its own chip products. Ample Semiconductors is investing in front-...
Howard Liu / South China Morning Post: Center for Technology & Statecraft: Chinese fabs had acquired ~343 DUVi tools by early 2026, with ~270 from ASML; DUVi can be adapted to...
India’s semiconductor journey has moved from policy foundations to actual chip production within just four years. In December 2021, the Government approved SEMICON 1.0 with an outl...
What if quantum processors could be tested before they are fully built? An indigenous resonator chip is helping validate the hardware path. Srsti Quantum has developed NAADA, a sup...
本連載では、半導体の高性能化において重要性が増す後工程を中心に解説する。前回は、半導体製造工程全体のイメージをつかむため、「前工程」を紹介した。今回は、後工程の入り口となる「ダイシ...
In 1884, an English schoolmaster wrote a short novel about a world with only length and breadth, whose inhabitants could not conceive of a third direction until one of them was lif...
Anton Shilov / Tom's Hardware: CTS: Chinese logic and memory chipmakers accumulated 343 ASML immersion DUV lithography scanners between 2012 and early 2026, many of which can make...
An online platform helps students learn chip design through practice in Verilog, testing, circuit design, synthesis, and chip layout. BitForBytes has launched a browser-based learn...
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