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Google is prepping Gemini Nano 4 for Android flagships, promising faster on-device AI and better efficiency while giving developers early access to build and optimize apps ahead of...
Huawei's upcoming flagship chip, built on innovative 3D IC stacking and the proprietary Tau Law, achieves performance parity with TSMC's 3nm process while bypassing EUV lithography...
Don't expect big upgrades elsewhere, though.
MediaTek has released the Dimensity 8550, a 4nm N4P mobile platform featuring an all-big-core Cortex-A725 CPU architecture, an 880 NPU unit with native Google Gemini Nano V3 suppor...
Internal code from Xiaomi has revealed details regarding the upcoming XRING 03 chipset, a component that introduces a radical departure from traditional processing structures. Expe...
Next-gen processors are edging ever closer to that fabled 5GHz mark.
Earlier this year, MediaTek unveiled the Dimensity 8500, a 4nm (TSMC N4P) chipset with all-big CPU cores (eight Cortex-A725) and a Mali-G720 MC8 GPU. Now the company is refreshing...
Компания MediaTek официально представила однокристальную систему Dimensity 8550. Первым коммерческим устройством на базе нового чипа стал смартфон Honor 600 Pro. Об этом сообщает и...
Qualcomm is expected to introduce the Snapdragon 8 Elite Gen 6 Pro and Snapdragon 8 Elite Gen 6 later this year, with both chipsets reportedly moving to TSMC’s 2nm manufacturing pr...
Qualcomm CEO Cristiano Amon has been spotted in Korea meeting with Samsung executives. The trip is all about manufacturing chips on the 2nm process, and there's a chance that Qualc...
Honor is unveiling the 600 and 600 Pro on April 23, and ahead of that the company is already teasing the duo internationally. Mere hours ago, we saw some leaked live images of the...
Snapdragon released its first Gen 5 chips last year with the Snapdragon 8 Elite Gen 5 and the vanilla 8 Gen 5. Now the company is extending this generation into the entry-level and...
MediaTek just unveiled the Dimensity 7500 with an upgraded CPU, GPU, and NPU. The SoC will compete head-on with Qualcomm's Snapdragon 7 series and will power upper-midrangers in th...
The Honor 600 and Honor 600 Pro bring meaningful upgrades across performance, battery life, and camera hardware, positioning them as strong contenders in the affordable flagship se...
About a year ago, Xiaomi introduced the Xiaomi 15S Pro, its first phone to be powered by an in-house chipset, which was called the Xring O1. This was a variant of the Xiaomi 15 Pro...
Rumored Tensor G6 supercharges Pixel 11’s CPU and AI, but its aging GPU may leave gamers disappointed.
The Google Pixel 11 lineup is likely to be announced in August, if the company sticks to its usual launch timeline. CAD-based renders of all models in the series have already surfa...
Recent leaks surrounding the upcoming Honor Magic9 suggest that the phone could feature a 6.36-inch display and a large 8,000mAh battery. Now, a fresh leak has revealed additional...
Samsung’s next chip upgrade could help future Galaxy phones run more AI tasks directly on-device, but it may also keep the best Galaxy AI tools out of reach for older flagships.
MediaTek's latest Dimensity (天玑) developer conference positions the chip platform as key to enabling smartphone AI agents, as daily autonomous AI task volume surged 7x year-over-...
В рамках проходящей на этой неделе Международной конференции по схемам и системам ISCAS 2026 китайская компания Huawei представила амбициозную концепцию развития полупроводникового...
MediaTek is expected to unveil the Dimensity 9600 SoC later this year as its next flagship chip, but the company is also working on the Dimensity 8600 upper-midrange SoC as well. T...
A familiar design and familiar specs make for a compelling phone.
MediaTek has expanded its mid-range portfolio with the quiet introduction of two new 5G-enabled chipsets: the Dimensity 7450 and Dimensity 7450X. These processors are designed to b...
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