AMD acquires AI chip startup Taalas to boost inference performance by etching models into silicon
Early tech demos show model-specific integrated circuits churning out up to 17,000 tokens a second
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Early tech demos show model-specific integrated circuits churning out up to 17,000 tokens a second
The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI I/O, and robust security/reliability features for intelligent...
Chipmaking changes could boost productivity of new ASML machines by 40 percent.
Can AI chip development become faster and less complex? A modular chiplet approach aims to simplify custom silicon design. TYLsemi has introduced a production-ready chiplet portfo...
Post-quantum semiconductor and digital identity developer SEALSQ Corp (NASDAQ: LAES) has announced an engineering update on QASIC (Quantum-Resistant Application-Specific Integrated...
NSA released ASIC Best Practices Threat Catalog and Application-Specific Integrated Circuit Level of Assurance 1 Best Practices. The post NSA Issues New Guidance to Address ASIC Se...
Next-gen systems double per-chip performance while cramming 3x as many into a rack
RackCommander groups MaxLinear's USB UARTs, RS-485 transceivers, GPIO expanders, and power devices for rack-level management.
New manufacturing platforms address high-aspect-ratio etching, advanced memory deposition, metal films, and silicon-carbide epitaxy for next-generation semiconductor production. Se...
XPower Technology unveils RPP architecture AE7100E chips at WAIC: fingernail-sized chips with 12 on one card, supporting 400B-1.6TB parameter models through distributed computing a...
Chinese AI companies are optimising software to cope with surging demand for inference, as part of that workload still relies on computing power from a limited pool of high-end chi...
Chinese chipmakers are setting increasingly aggressive targets to source production equipment locally, adding pressure on domestic toolmakers to come up with machines that are reli...
No longer confined to repetitive testing, hardware verification is entering an era where AI amplifies engineering judgment and expertise. Application-specific integrated circuit (A...
Eric Sivertson, vice president of security business at Lattice Semiconductor, explains how FPGAs can act as deterministic guardrails for robotic systems. The post How FPGAs become...
SemiAnalysis: A detailed look at Jalapeño, OpenAI's ASIC developed with Broadcom in 16 months, which beat Nvidia, AMD, and Google chips on multiple top open-weight models — OpenA...
The AI startup’s deal with Riot signals a growing need as the build-out of data centers expands across the U.S.
Every major Chinese GPU maker agrees at WAIC 2026: the era of single-chip competition is over. Supernode architecture, optical interconnection, and system-level TCO define the next...
Insider Brief Press release – SEALSQ Corp (NASDAQ: LAES) (“SEALSQ” or the “Company”), a global leader in post-quantum semiconductor, Public Key Infrastructure (“PKI”) and digital i...
Nine public miners generated $341 million from AI and HPC operations in the first half of 2026 after spending more than $5 billion on capital assets. Public Bitcoin miners are spen...
Announced today, the company's new CSS for Mobile 2 platform, Total Design for Physical AI program, and Neoverse CSS N4 platform provide specialized architectures for agentic AI wo...
At DAC 2026, Synopsys, Cadence, and Siemens EDA each unveiled agentic AI strategies for chip design, from Synopsys' L1-L5 autonomy ladder and Cadence's AuraStack super agent to Sie...
“Custom chip” is the new buzzword. Everyone is getting into it. The big and the small. The public and the private. Companies that never built anything but software and companies th...
AI and HPC are reshaping mining economics as operators repurpose power and data centers, while a smaller group of miners continues to expand Bitcoin capacity. Publicly traded Bitco...
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