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Can AI chip development become faster and less complex? A modular chiplet approach aims to simplify custom silicon design. TYLsemi has introduced a production-ready chiplet portfo...
In this edition of Business Shorts, we spotlight five announcements that show AI demand is reshaping everything from Wall Street financing to washing machines.
When we talk about the AI boom, we usually talk about: ChatGPT Claude Gemini AI agents GPUs LLMs But underneath all of those technologies is something much more fundamental: Sem...
AI tools help automate chip design, testing, and heat analysis, cutting development time and reducing the need for manual work. Synopsys has introduced a new set of AI-powered engi...
Anthropic has verified that it is assembling an internal team tasked with creating bespoke chips for its Claude AI models. This marks the first occasion the company has openly reco...
A new semiconductor integration platform combines dense chip packaging, faster interconnects and thermal analysis to tackle key challenges in next-generation AI hardware systems mo...
What happens when AI chips push semiconductor testing beyond conventional limits? These instruments can tackle rising demands for speed, connectivity, and power. Teradyne has laun...
At DAC 2026, Synopsys, Cadence, and Siemens EDA each unveiled agentic AI strategies for chip design, from Synopsys' L1-L5 autonomy ladder and Cadence's AuraStack super agent to Sie...
New industrial boards pair Intel 18A processors with integrated graphics and AI acceleration, bringing faster inference and demanding workloads closer to connected edge environment...
https://www.youtube.com/watch?v=_OoB3WxBQq0 这期由基地发布的视频，深度剖析了 AMD 在 2026 年 8 月收购芯片初创公司 Taalas 及其推出的 HCE（Hardcoded Engine） 芯片背后的技术细节与商业...
New server management, battery monitoring, and security silicon targets AI and HPC platforms with integrated management, post-quantum security, high-voltage battery support, and im...
Announced today, the company's new CSS for Mobile 2 platform, Total Design for Physical AI program, and Neoverse CSS N4 platform provide specialized architectures for agentic AI wo...
India’s Centre for Development of Advanced Computing (C-DAC) has moved its indigenous AI inference chip into trial production, partnering with HCL Infosystems to validate its desig...
Huawei บุกขายชิป AI ในเกาหลีใต้บ้านของ Samsung, แรงกว่า H20 ถูกกว่า 4 เท่า โดย Nokka (นก-กา), นักเขียนอิสระสายเทคโนโลยี ผู้เขียนบทความอธิบายเทคโนโลยีให้คนทั่วไปเข้าใจ 30+ บทความบ...
What's New: Intel is showcasing three architectures for Agentic AI and Enterprise-scale workloads, combining the Diamond Rapids processor for high-performance orchestration, the C...
The company said its ‘purpose-built 5nm ASIC’ chip aims to optimise AV systems for ‘low-latency performance’. Read more: Waymo details custom AI silicon for autonomous vehicles
Our technology correspondent Adam Satariano explains how the future of artificial intelligence may be determined by the number of A.I. chips around the world.
A new compact edge computing platform brings AI acceleration, advanced visual processing and flexible connectivity to industrial systems, supporting smarter applications in space-c...
What happens when memory moves closer to the AI processor? A new architecture could reshape how future systems handle data. Samsung Electronics showcased memory and storage technol...
A new compact embedded motherboard combines AI-capable processing, high-capacity memory, and versatile connectivity to support demanding edge computing applications in space-constr...
Announced today, the new Ryzen AI Embedded X100 Series and Kria AI platform unify CPU, GPU, and NPU compute to provide the low-latency performance and deterministic control require...
Can AI computing move beyond Earth? An orbital data centre concept aims to process workloads in space using advanced accelerator chips. SpaceX has collaborated with Nvidia to devel...
Artificial intelligence is pushing semiconductor technology toward a physical limit: the more computing power engineers pack into a system, the more difficult it becomes to move da...
Early tech demos show model-specific integrated circuits churning out up to 17,000 tokens a second
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