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Samsung’s unveiling of the first 3D stacked transistor marks a new era in semiconductor design, as stacking could theoretically double device density instantly compared to current...
A team of researchers from POSTECH (Pohang University of Science and Technology) in South Korea has unveiled a groundbreaking technique for stacking more than ten ultrathin semicon...
University of Illinois researchers led by Professor Cao Qing demonstrate a monolithic 3D integration technique that stacks transistor layers at low temperatures with near-perfect y...
Insider Brief PRESS RELEASE — Researchers led by Illinois Grainger Engineering professor Qing Cao have demonstrated a scalable way to directly and sequentially stack high-performan...
A chip design tool treats multilayer chips as one 3D structure, reducing wire length by 30% while improving performance and thermal management. Peking University’s School of Integr...
With EUV lithography tools restricted, Chinese AI chip designers are betting on 3D hybrid bonding and stacking technology to bypass traditional scaling limits and compete on perfor...
Two power switches in one package save board space, reduce power loss, and help engineers build power systems. Alpha and Omega Semiconductor (AOS) has introduced the AOPL66801, an...
Chinese AI chip companies are increasingly turning to 3D stacking technology as a strategic alternative to advanced process node upgrades, as the industry confr...
Researchers may have unlocked the future of computing by turning flat silicon chips into densely stacked 3D architectures. For decades, the semiconductor industry has boosted compu...
For over fifty years, the relentless pursuit to enhance computing power has centered on shrinking transistors and densely packing them onto silicon chips. This well-established tra...
На протяжении более чем десятилетия архитектура транзисторов с вертикальным затвором (Fin Field-Effect Transistor, FinFET) служила главным технологическим фундаментом микроэлектрон...
In a groundbreaking advance poised to redefine the future of self-sustaining electronics, researchers have unveiled a monolithic three-dimensional integrated circuit that seamlessl...
Следование закону Мура едва не прекратилось из-за физических пределов производства полупроводников, но учёные уже спешат ухватить годами выполнявшийся принцип за ускользающий хвост...
Paragraf recently introduced a new GFET, a next-generation graphene transistor platform designed for scalable molecular sensing and research applications.
Researchers designed a twisted 2D conductive MOF that preserves its electronic properties when stacked, advancing practical 2D materials.
Can 2D semiconductors replace silicon? A new pilot line targets 5nm-equivalent chips without relying on EUV lithography by 2029. Shanghai-based semiconductor start-up Yuanjiwei has...
Инженеры предложили новый способ наращивания памяти для ускорителей ИИ и графических процессоров: вместо укладки кристаллов DRAM привычной «башней», как в HBM, их предлагается уста...
A computer built with a 2D semiconductor integrates more than 1,400 transistors on one chip, demonstrating a path toward AI and edge computing. Researchers from Nanjing University,...
ROHM Semiconductor has launched the TSC3PAK, a new package for SiC MOSFETs that delivers heat dissipation performance comparable to conventional TO-247-4L through-hole packages whi...
Jusung Engineering announced Monday that it has shipped what it described as the world’s first atomic layer growth (ALG) transistor full-integration semiconductor manufacturing equ...
New 600V super junction MOSFETs improve thermal performance, reduce switching losses, and simplify second-source replacement, enabling compact, efficient power designs for AI serve...
A newly introduced surface-mount package for silicon carbide power devices combines high heat dissipation, 1200V-class voltage support, and automated assembly compatibility, target...
Крупнейший в мире производитель чипов памяти Samsung разработал первый в мире прототип 900-слойного чипа памяти, сообщает ETNews — проект призван закрепить лидерство корейского тех...
Synopsys announces Multiphysics Fusion products and early customers to lower prevent respins and lower costs
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