Social Media Ideas for 3D Chips

Prototype Software Improves 3D Chip Optimization

A chip design tool treats multilayer chips as one 3D structure, reducing wire length by 30% while improving performance and thermal management. Peking University’s School of Integr...

University of Illinois Team Advances Monolithic 3D Chip Design

Insider Brief PRESS RELEASE — Researchers led by Illinois Grainger Engineering professor Qing Cao have demonstrated a scalable way to directly and sequentially stack high-performan...

В США испытали метод стекового производства 3D-чипов, кратно превосходящий по плотности все современные

Следование закону Мура едва не прекратилось из-за физических пределов производства полупроводников, но учёные уже спешат ухватить годами выполнявшийся принцип за ускользающий хвост...

2D Chip Opens New Path for Computing

A computer built with a 2D semiconductor integrates more than 1,400 transistors on one chip, demonstrating a path toward AI and edge computing. Researchers from Nanjing University,...

Chinese AI Chip Makers Turn to 3D Stacking for a 'Curve-Overtaking' Advantage

With EUV lithography tools restricted, Chinese AI chip designers are betting on 3D hybrid bonding and stacking technology to bypass traditional scaling limits and compete on perfor...

The Next Computing Revolution May Come From Stacking Chips Like Skyscrapers

Researchers may have unlocked the future of computing by turning flat silicon chips into densely stacked 3D architectures. For decades, the semiconductor industry has boosted compu...

Samsung First To Build 3D Stacked Transistors

Samsung’s unveiling of the first 3D stacked transistor marks a new era in semiconductor design, as stacking could theoretically double device density instantly compared to current...

Stacking semiconductor chips like skyscrapers to enhance performance

A team of researchers from POSTECH (Pohang University of Science and Technology) in South Korea has unveiled a groundbreaking technique for stacking more than ten ultrathin semicon...

Chinese AI Chip Makers Turn to 3D Stacking to Break Through Process Bottlenecks

Chinese AI chip companies are increasingly turning to 3D stacking technology as a strategic alternative to advanced process node upgrades, as the industry confr...

Monolithic 3D Integration Breakthrough Could Reshape the Semiconductor Roadmap

University of Illinois researchers led by Professor Cao Qing demonstrate a monolithic 3D integration technique that stacks transistor layers at low temperatures with near-perfect y...

New '3D' Computer Chips Could Extend Moore's Law, Study Shows

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MIT Chip Builds Real-Time 3D Maps for Robots on the Power of One LED

Called Gleanmer, the 16-nm system-on-chip swaps memory-hungry voxels for compact Gaussian “blobs” to map and navigate at roughly 6 mW.

The quest for better chip design accelerates

Synopsys announces Multiphysics Fusion products and early customers to lower prevent respins and lower costs

Monolithic 3D Integration Enables Self-Powered Smart Electronics

In a groundbreaking advance poised to redefine the future of self-sustaining electronics, researchers have unveiled a monolithic three-dimensional integrated circuit that seamlessl...

Chip tech to deliver major performance leap: IBM

We Thought Computer Chips Were Running Out of Room. IBM Found a New Way Forward.

The new chip technology packs nearly 100 billion transistors into a fingernail-sized chip.

Chip Cooling Technique for AI

A new in-package cooling innovation tackles rising heat challenges in 3D-stacked memory chips, improving thermal efficiency and stability for AI workloads while enabling higher ban...

Huawei and scientists build 2D parallel computing chip that rewrites Moore’s Law

Chinese researchers, in collaboration with Huawei Technologies, have built the world’s first parallel processor using a two-dimensional (2D) semiconductor. As silicon devices appro...

IBM fits ~100 billion transistors on a fingernail-sized chip

Record-breaking IBM chip uses trick to cram in 100 billion transistors

IBM's latest chip packs in twice as many transistors as the current state-of-the-art chip by adding a second layer of silicon circuitry

Breaking AI Bottlenecks: 3 Startups Look Beyond the Chip

Lotus Microsystems, Oriole Networks, and Atomera have each rolled out technologies tackling the physical limits slowing AI infrastructure.

Pilot Line Advances 2D Chipmaking 

Can 2D semiconductors replace silicon? A new pilot line targets 5nm-equivalent chips without relying on EUV lithography by 2029. Shanghai-based semiconductor start-up Yuanjiwei has...

Revolutionizing Chip Design: Sequential Silicon Stacking to Push Moore’s Law Further

For over fifty years, the relentless pursuit to enhance computing power has centered on shrinking transistors and densely packing them onto silicon chips. This well-established tra...

Сто лет ожидания: как забытая идея открыла путь к настоящим 3D-чипам

В октябре 1925 года австро-венгерский физик Юлиус Лилиенфельд подал патент на устройство, которое он назвал «Метод и аппарат для управления электрическими токами». Он так и не собр...